HSS28-B20-P39
CUI Devices
Product No:
HSS28-B20-P39
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Package:
-
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-
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Description:
HEAT SINK, STAMPING, TO-218/TO-2
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Product Information
Parameter Info
User Guide
| Shape | Square, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.374" (9.50mm) |
| Series | HSS |
| Thermal Resistance @ Forced Air Flow | 12.00°C/W @ 200 LFM |
| Type | Board Level |
| Length | 0.748" (19.00mm) |
| Thermal Resistance @ Natural | 27.66°C/W |
| Mfr | CUI Devices |
| Package | Bag |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On and PC Pin |
| Width | 0.748" (19.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 2.71W @ 75°C |
| Package Cooled | TO-218, TO-220 |
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