HSS08-B18-CP
CUI Devices
型号:
HSS08-B18-CP
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, STAMPING, TO-218, 44.
购买数量:
递送:
付款:
库存 : 988
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.9475
$1.9475
10
$1.89905
$18.9905
25
$1.84794
$46.1985
50
$1.74534
$87.267
100
$1.642645
$164.2645
250
$1.539988
$384.997
500
$1.488669
$744.3345
1000
$1.334664
$1334.664
5000
$1.308996
$6544.98
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产品信息
参数信息
用户指南
| Shape | Square |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.492" (12.50mm) |
| Series | HSS |
| Thermal Resistance @ Forced Air Flow | 3.50°C/W @ 200 LFM |
| Type | Board Level, Vertical |
| Length | 1.750" (44.45mm) |
| Thermal Resistance @ Natural | 7.29°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | PC Pin |
| Width | 1.750" (44.45mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 10.3W @ 75°C |
| Package Cooled | TO-218 |
