HSS23-B20-NP
CUI Devices
型号:
HSS23-B20-NP
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, STAMPING, TO-218/TO-2
购买数量:
递送:
付款:
库存 : 2588
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$0.741
$0.741
10
$0.71345
$7.1345
25
$0.69312
$17.328
50
$0.65189
$32.5945
100
$0.585865
$58.5865
250
$0.5776
$144.4
500
$0.540493
$270.2465
1000
$0.532238
$532.238
请发送询价，我们将立即回复。
产品信息
参数信息
用户指南
| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.787" (20.00mm) |
| Series | HSS |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.654" (42.00mm) |
| Thermal Resistance @ Natural | 10.19°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On |
| Width | 1.496" (38.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 7.36W @ 75°C |
| Package Cooled | TO-218, TO-220 |
