HSS25-B20-P51
CUI Devices
Product No:
HSS25-B20-P51
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Package:
-
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-
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Description:
HEAT SINK, STAMPING, TO-218/TO-2
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Product Information
Parameter Info
User Guide
| Shape | Square, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 1.673" (42.50mm) |
| Series | HSS |
| Thermal Resistance @ Forced Air Flow | 6.30°C/W @ 200 LFM |
| Type | Board Level |
| Length | 1.000" (25.40mm) |
| Thermal Resistance @ Natural | 12.75°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | PC Pin |
| Width | 1.000" (25.40mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 5.88W @ 75°C |
| Package Cooled | TO-218, TO-220 |
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