HSB18-232310
CUI Devices
Product No:
HSB18-232310
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 10 MM
Quantity:
Delivery:
Payment:
In Stock : 5332
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.988
$0.988
10
$0.9386
$9.386
25
$0.89148
$22.287
50
$0.86792
$43.396
100
$0.856235
$85.6235
250
$0.79762
$199.405
500
$0.750709
$375.3545
1000
$0.680333
$680.333
5000
$0.656878
$3284.39
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Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 6.80°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 0.906" (23.00mm) |
| Thermal Resistance @ Natural | 20.41°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 0.906" (23.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 3.7W @ 75°C |
| Package Cooled | BGA |
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