HSE11-B20-NP
CUI Devices
型号:
HSE11-B20-NP
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, EXTRUSION, TO-218/TO-
购买数量:
递送:
付款:
库存 : 请查询
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产品信息
参数信息
用户指南
| Shape | Rectangular |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.177" (4.50mm) |
| Series | HSE |
| Thermal Resistance @ Forced Air Flow | 21.40°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 0.984" (25.00mm) |
| Thermal Resistance @ Natural | 38.90°C/W |
| Mfr | CUI Devices |
| Package | Bag |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On |
| Width | 0.472" (12.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 1.93W @ 75°C |
| Package Cooled | TO-218, TO-220 |
