HSE06-503045
CUI Devices
型号:
HSE06-503045
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, EXTRUSION, TO-218/TO-
购买数量:
递送:
付款:
库存 : 1101
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$2.2325
$2.2325
10
$2.15745
$21.5745
25
$2.0957
$52.3925
50
$1.97087
$98.5435
100
$1.771275
$177.1275
250
$1.74629
$436.5725
500
$1.634038
$817.019
1000
$1.609082
$1609.082
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产品信息
参数信息
用户指南
| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 1.772" (45.00mm) |
| Series | HSE |
| Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |
| Type | Board Level |
| Length | 1.969" (50.00mm) |
| Thermal Resistance @ Natural | 5.86°C/W |
| Mfr | CUI Devices |
| Package | Bag |
| Material Finish | Black Anodized |
| Attachment Method | Clip |
| Width | 1.181" (30.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 12.79W @ 75°C |
| Package Cooled | TO-218, TO-220 |
