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HSE-B500-04H
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HSE-B500-04H

CUI Devices

型号:

HSE-B500-04H

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

pdf

描述:

HEAT SINK, EXTRUSION, TO-220, 50

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 1.000" (25.40mm)
Series HSE
Thermal Resistance @ Forced Air Flow 2.88°C/W @ 200 LFM
Type Board Level, Vertical
Length 1.969" (50.00mm)
Thermal Resistance @ Natural 8.05°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Width 1.378" (35.00mm)
Diameter -
Power Dissipation @ Temperature Rise 12.2W @ 75°C
Package Cooled TO-220
Base Product Number HSE-B500