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HSE-B18635-035H-04
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HSE-B18635-035H-04

CUI Devices

型号:

HSE-B18635-035H-04

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

pdf

描述:

HEAT SINK, EXTRUSION, TO-218, 63

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Shape Rectangular, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.984" (25.00mm)
Series HSE
Thermal Resistance @ Forced Air Flow 2.38°C/W @ 200 LFM
Type Board Level, Vertical
Length 2.500" (63.50mm)
Thermal Resistance @ Natural 4.97°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Clip and PC Pin
Width 1.638" (41.60mm)
Diameter -
Power Dissipation @ Temperature Rise 15.1W @ 75°C
Package Cooled TO-218
Base Product Number HSE-B18635