HSB30-373710
CUI Devices
型号:
HSB30-373710
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 37.4 X 37 X 10 M
购买数量:
递送:
付款:
库存 : 545
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$2.128
$2.128
10
$2.05865
$20.5865
25
$1.9988
$49.97
50
$1.87986
$93.993
100
$1.68948
$168.948
250
$1.665692
$416.423
500
$1.558608
$779.304
1000
$1.53482
$1534.82
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 4°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.472" (37.39mm) |
| Thermal Resistance @ Natural | 11.63°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Width | 1.472" (37.39mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 6.45W @ 75°C |
| Package Cooled | BGA |
