HSB28-606022
CUI Devices
型号:
HSB28-606022
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 60 X 60 X 22 MM,
购买数量:
递送:
付款:
库存 : 79
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$6.2985
$6.2985
10
$6.09235
$60.9235
25
$5.91584
$147.896
50
$5.56377
$278.1885
100
$5.000325
$500.0325
250
$4.929892
$1232.473
500
$4.612991
$2306.4955
1000
$4.542558
$4542.558
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.866" (22.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 1.40°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 2.362" (60.00mm) |
| Thermal Resistance @ Natural | 4.74°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Width | 2.362" (60.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 15.83W @ 75°C |
| Package Cooled | BGA |
