HSB27-434316
CUI Devices
Product No:
HSB27-434316
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 43.1 X 43.1 X 16
Quantity:
Delivery:
Payment:
In Stock : 996
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$2.47
$2.47
10
$2.3902
$23.902
25
$2.32104
$58.026
50
$2.1831
$109.155
100
$1.96194
$196.194
250
$1.934352
$483.588
500
$1.809997
$904.9985
1000
$1.782371
$1782.371
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Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.650" (16.51mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 2.80°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.697" (43.10mm) |
| Thermal Resistance @ Natural | 8.35°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 1.697" (43.10mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 8.98W @ 75°C |
| Package Cooled | BGA |
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