HSB26-343408
CUI Devices
型号:
HSB26-343408
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 33.5 X 33.5 X 8
购买数量:
递送:
付款:
库存 : 994
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.083
$1.083
10
$1.04595
$10.4595
25
$1.01536
$25.384
50
$0.95513
$47.7565
100
$0.858325
$85.8325
250
$0.84626
$211.565
500
$0.791882
$395.941
1000
$0.779788
$779.788
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.315" (8.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 5.30°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.319" (33.50mm) |
| Thermal Resistance @ Natural | 15.19°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 1.319" (33.50mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 4.94W @ 75°C |
| Package Cooled | BGA |
