HSB25-282810
CUI Devices
型号:
HSB25-282810
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 28.5 X 28.5 X 10
购买数量:
递送:
付款:
库存 : 1518
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.235
$1.235
10
$1.1951
$11.951
25
$1.16052
$29.013
50
$1.09155
$54.5775
100
$0.98097
$98.097
250
$0.967176
$241.794
500
$0.905008
$452.504
1000
$0.891186
$891.186
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 5.10°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.122" (28.50mm) |
| Thermal Resistance @ Natural | 15.41°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Width | 1.122" (28.50mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 4.87W @ 75°C |
| Package Cooled | BGA |
