HSB25-282810
CUI Devices
Product No:
HSB25-282810
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 28.5 X 28.5 X 10
Quantity:
Delivery:
Payment:
In Stock : 1518
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$1.235
$1.235
10
$1.1951
$11.951
25
$1.16052
$29.013
50
$1.09155
$54.5775
100
$0.98097
$98.097
250
$0.967176
$241.794
500
$0.905008
$452.504
1000
$0.891186
$891.186
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Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 5.10°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.122" (28.50mm) |
| Thermal Resistance @ Natural | 15.41°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Width | 1.122" (28.50mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 4.87W @ 75°C |
| Package Cooled | BGA |
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