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HSB24-252510
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HSB24-252510

CUI Devices

型号:

HSB24-252510

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

pdf

描述:

HEAT SINK, BGA,25 X 25 X 10 MM

购买数量:

递送:

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付款:

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库存 : 737

最小起订量: 1 最小递增量: 1

数量

单价

总价

  • 1

    $0.7695

    $0.7695

  • 10

    $0.7467

    $7.467

  • 25

    $0.72542

    $18.1355

  • 50

    $0.68229

    $34.1145

  • 100

    $0.61313

    $61.313

  • 250

    $0.604504

    $151.126

  • 500

    $0.56563

    $282.815

  • 1000

    $0.556985

    $556.985

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产品信息

参数信息

用户指南

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.394" (10.00mm)
Series HSB
Thermal Resistance @ Forced Air Flow 6.50°C/W @ 200 LFM
Type Top Mount
Length 0.984" (25.00mm)
Thermal Resistance @ Natural 18.10°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.984" (25.00mm)
Diameter -
Power Dissipation @ Temperature Rise 4.14W @ 75°C
Package Cooled BGA