HSB21-454515
CUI Devices
型号:
HSB21-454515
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 45 X 45 X 15 MM
购买数量:
递送:
付款:
库存 : 380
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$2.0235
$2.0235
10
$1.9703
$19.703
25
$1.9171
$47.9275
50
$1.81051
$90.5255
100
$1.70411
$170.411
250
$1.597558
$399.3895
500
$1.54432
$772.16
1000
$1.384558
$1384.558
5000
$1.35793
$6789.65
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.591" (15.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 2.80°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.772" (45.00mm) |
| Thermal Resistance @ Natural | 7.56°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 1.772" (45.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 9.9W @ 75°C |
| Package Cooled | BGA |
