HSB20-353525
CUI Devices
型号:
HSB20-353525
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 35 X 35 X 25 MM
购买数量:
递送:
付款:
库存 : 478
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.881
$1.881
10
$1.8316
$18.316
25
$1.7822
$44.555
50
$1.6834
$84.17
100
$1.584315
$158.4315
250
$1.485306
$371.3265
500
$1.435792
$717.896
1000
$1.287269
$1287.269
5000
$1.262512
$6312.56
请发送询价，我们将立即回复。
产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.984" (25.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.378" (35.00mm) |
| Thermal Resistance @ Natural | 6.65°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 1.378" (35.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 11.3W @ 75°C |
| Package Cooled | BGA |
