HSB13-303014
CUI Devices
型号:
HSB13-303014
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 30.7 X 30.7 X 14
购买数量:
递送:
付款:
库存 : 419
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.2825
$1.2825
10
$1.2217
$12.217
25
$1.1894
$29.735
50
$1.1571
$57.855
100
$1.09288
$109.288
250
$1.028584
$257.146
500
$0.964288
$482.144
1000
$0.900011
$900.011
5000
$0.867863
$4339.315
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产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.551" (14.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 4.70°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.209" (30.70mm) |
| Thermal Resistance @ Natural | 12.36°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 1.209" (30.70mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 6.1W @ 75°C |
| Package Cooled | BGA |
