HSB05-171711
CUI Devices
型号:
HSB05-171711
品牌:
封装:
-
批次:
-
数据手册:
描述:
HEAT SINK, BGA, 17 X 17 X 11.5 M
购买数量:
递送:
付款:
库存 : 2573
最小起订量: 1 最小递增量: 1
数量
单价
总价
1
$1.026
$1.026
10
$0.97565
$9.7565
25
$0.94962
$23.7405
50
$0.92397
$46.1985
100
$0.87267
$87.267
250
$0.821332
$205.333
500
$0.769994
$384.997
1000
$0.718666
$718.666
5000
$0.692996
$3464.98
请发送询价，我们将立即回复。
产品信息
参数信息
用户指南
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.453" (11.50mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 8.40°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 0.669" (17.00mm) |
| Thermal Resistance @ Natural | 23.91°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 0.669" (17.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Package Cooled | BGA |
