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HSB04-171706
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HSB04-171706

CUI Devices

型号:

HSB04-171706

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

pdf

描述:

HEAT SINK, BGA, 17 X 17 X 6 MM

购买数量:

递送:

1.webp 4.webp 5.webp 2.webp 3.webp

付款:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

库存 : 3251

最小起订量: 1 最小递增量: 1

数量

单价

总价

  • 1

    $0.7695

    $0.7695

  • 10

    $0.7372

    $7.372

  • 25

    $0.69996

    $17.499

  • 50

    $0.68172

    $34.086

  • 100

    $0.67241

    $67.241

  • 250

    $0.626354

    $156.5885

  • 500

    $0.589513

    $294.7565

  • 1000

    $0.534252

    $534.252

  • 5000

    $0.515831

    $2579.155

请发送询价,我们将立即回复。

产品信息

参数信息

用户指南

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.236" (6.00mm)
Series HSB
Thermal Resistance @ Forced Air Flow 13.10°C/W @ 200 LFM
Type Top Mount
Length 0.669" (17.00mm)
Thermal Resistance @ Natural 29.73°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.669" (17.00mm)
Diameter -
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Package Cooled BGA