HSB03-141406
CUI Devices
Product No:
HSB03-141406
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 14 X 14 X 6 MM
Quantity:
Delivery:
Payment:
In Stock : 3465
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.703
$0.703
10
$0.67165
$6.7165
25
$0.63802
$15.9505
50
$0.6213
$31.065
100
$0.612845
$61.2845
250
$0.570912
$142.728
500
$0.53732
$268.66
1000
$0.486951
$486.951
5000
$0.470155
$2350.775
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Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.236" (6.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 15.80°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 0.551" (14.00mm) |
| Thermal Resistance @ Natural | 35.98°C/W |
| Mfr | CUI Devices |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 0.551" (14.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 2.1W @ 75°C |
| Package Cooled | BGA |
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