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HSB02-101007
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HSB02-101007

CUI Devices

型号:

HSB02-101007

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

pdf

描述:

HEAT SINK, BGA, 10 X 10 X 7 MM

购买数量:

递送:

1.webp 4.webp 5.webp 2.webp 3.webp

付款:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

库存 : 3172

最小起订量: 1 最小递增量: 1

数量

单价

总价

  • 1

    $0.6365

    $0.6365

  • 10

    $0.6061

    $6.061

  • 25

    $0.57608

    $14.402

  • 50

    $0.56088

    $28.044

  • 100

    $0.553375

    $55.3375

  • 250

    $0.515432

    $128.858

  • 500

    $0.485127

    $242.5635

  • 1000

    $0.439641

    $439.641

  • 5000

    $0.424479

    $2122.395

请发送询价,我们将立即回复。

产品信息

参数信息

用户指南

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.275" (7.00mm)
Series HSB
Thermal Resistance @ Forced Air Flow 16.50°C/W @ 200 LFM
Type Top Mount
Length 0.394" (10.00mm)
Thermal Resistance @ Natural 37.90°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.394" (10.00mm)
Diameter -
Power Dissipation @ Temperature Rise 2.0W @ 75°C
Package Cooled BGA