TSX713
detaildesc

TSX713

EDSYN INCORPORATED

型号:

TSX713

封装:

-

批次:

-

数据手册:

-

描述:

REFLOW VACUUM TIP, HOLE DIA: 1.3

购买数量:

递送:

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付款:

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库存 : 5

最小起订量: 1 最小递增量: 1

数量

单价

总价

  • 1

    $26.1725

    $26.1725

请发送询价,我们将立即回复。

产品信息

参数信息

用户指南

Tip Chip Size -
Tip Type Rework
Product Status Active
Series SOLDAVAC®
For Use With/Related Products -
Length 0.551" (14.00mm)
Mfr EDSYN INCORPORATED
Temperature Range -
Height -
Package Bag
Tip Shape Nozzle
Width -
Diameter 0.051" (1.30mm)