SP1-100X100-G
detaildesc

SP1-100X100-G

BusBoard Prototype Systems

型号:

SP1-100X100-G

封装:

-

批次:

-

数据手册:

pdf

描述:

SMTPADS-1 100X100MIL PADS, TOP-S

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Material FR4 Epoxy Glass
Size / Dimension 3.15" L x 1.97" W (80.0mm x 50.0mm)
Product Status Active
Series -
Circuit Pattern Pad Per Hole (Square)
Mfr BusBoard Prototype Systems
Plating Non-Plated Through Hole (NPTH)
Proto Board Type Breadboard, General Purpose
Pitch -
Hole Diameter -
Package Bag
Edge Contacts -
Board Thickness 0.063" (1.60mm)