SL-108-TT-11

Samtec Inc.

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SL-108-TT-11

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CONN RCPT 8POS 0.1 TIN PCB

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Insulation Height	0.132" (3.35mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	-
Contact Type	Female Socket
Material Flammability Rating	-
Product Status	Active
Contact Material	Beryllium Copper
Mfr	Samtec Inc.
Connector Type	Receptacle
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Tin
Operating Temperature	-55°C ~ 105°C
Number of Rows	1
Applications	-
Number of Positions	8
Termination	Solder
Mounting Type	Through Hole
Fastening Type	Push-Pull
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post	-
Contact Shape	Circular
Series	SL
Row Spacing - Mating	-
Insulation Color	Black
Contact Finish - Post	Tin
Number of Positions Loaded	All
Contact Length - Post	0.108" (2.75mm)
Package	Bulk
Mated Stacking Heights	-
Base Product Number	SL-108