SIDC01D60C6
detaildesc

SIDC01D60C6

Infineon Technologies

型号:

SIDC01D60C6

封装:

Sawn on foil

批次:

-

数据手册:

pdf

描述:

DIODE GEN PURP WAFER

购买数量:

递送:

1.webp 4.webp 5.webp 2.webp 3.webp

付款:

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库存 : 请查询

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产品信息

参数信息

用户指南

Speed Standard Recovery >500ns, > 200mA (Io)
Capacitance @ Vr, F -
Mounting Type Surface Mount
Product Status Discontinued at Digi-Key
Supplier Device Package Sawn on foil
Series -
Package / Case Die
Technology Standard
Mfr Infineon Technologies
Package Bulk
Operating Temperature - Junction -55°C ~ 150°C
Current - Average Rectified (Io) -
Base Product Number SIDC01