SBB0802P-1
detaildesc

SBB0802P-1

Chip Quik Inc.

型号:

SBB0802P-1

封装:

-

批次:

-

数据手册:

-

描述:

SOLDER-IN BREADBOARD 1X1" (8 ROW

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Material FR4 Epoxy Glass
Size / Dimension 1.00" L x 1.00" W (25.4mm x 25.4mm)
Product Status Active
Series Proto-Advantage
Circuit Pattern Pad Per Hole (Round)
Mfr Chip Quik Inc.
Plating Plated Through Hole (PTH)
Proto Board Type Breadboard, General Purpose
Pitch 0.1" (2.54mm) Grid
Hole Diameter 0.039" (1.00mm)
Package Bulk
Edge Contacts -
Board Thickness 0.063" (1.60mm)