FI-XB30SRL-HF11-R3000
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FI-XB30SRL-HF11-R3000

JAE Electronics

型号:

FI-XB30SRL-HF11-R3000

封装:

-

批次:

-

数据手册:

pdf

描述:

CONN RCPT 30P 0.039 GOLD SMD R/A

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Insulation Height -
Ingress Protection -
Voltage Rating 200V
Current Rating (Amps) 1A per Contact
Contact Finish Thickness - Mating 12.0µin (0.30µm)
Contact Type Non-Gendered
Material Flammability Rating UL94 V-0
Product Status Obsolete
Contact Material Copper Alloy
Mfr JAE Electronics
Connector Type Receptacle
Style Board to Cable/Wire
Pitch - Mating 0.039" (1.00mm)
Features Grounding Pins, Shielded, Solder Retention
Contact Finish - Mating Gold
Operating Temperature -40°C ~ 80°C
Number of Rows 1
Applications General Purpose
Number of Positions 30
Termination Solder
Mounting Type Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Fastening Type Friction Lock
Insulation Material Plastic
Contact Finish Thickness - Post -
Contact Shape -
Series FI-X
Row Spacing - Mating -
Insulation Color Black
Contact Finish - Post Tin
Number of Positions Loaded All
Contact Length - Post -
Package Tape & Reel (TR)
Mated Stacking Heights -
Base Product Number FI-XB30