FI-X30SSL-HF
detaildesc

FI-X30SSL-HF

JAE Electronics

Product No:

FI-X30SSL-HF

Manufacturer:

JAE Electronics

Package:

-

Batch:

-

Datasheet:

pdf

Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Insulation Height 0.091" (2.30mm)
Ingress Protection -
Voltage Rating 200V
Current Rating (Amps) 1A per Contact
Contact Finish Thickness - Mating 3.90µin (0.099µm)
Contact Type Non-Gendered
Material Flammability Rating UL94 V-0
Product Status Obsolete
Contact Material Copper Alloy
Mfr JAE Electronics
Connector Type Receptacle
Style Board to Cable/Wire
Pitch - Mating 0.039" (1.00mm)
Features Grounding Pins, Shielded, Solder Retention
Contact Finish - Mating Gold
Operating Temperature -40°C ~ 80°C
Number of Rows 1
Applications General Purpose
Number of Positions 30
Termination Solder
Mounting Type Surface Mount, Right Angle
Fastening Type Friction Lock
Insulation Material Plastic
Contact Finish Thickness - Post -
Contact Shape -
Series FI-X
Row Spacing - Mating -
Insulation Color Beige
Contact Finish - Post Tin
Number of Positions Loaded All
Contact Length - Post -
Package Tray
Mated Stacking Heights -
Base Product Number FI-X30