FI-TD50SB-E
detaildesc

FI-TD50SB-E

JAE Electronics

型号:

FI-TD50SB-E

封装:

-

批次:

-

数据手册:

pdf

描述:

CONN RCPT 50POS 0.05 GOLD SMD

购买数量:

递送:

1.webp 4.webp 5.webp 2.webp 3.webp

付款:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

库存 : 请查询

请发送RFQ,我们将立即回复。

产品信息

参数信息

用户指南

Insulation Height 0.110" (2.79mm)
Ingress Protection -
Voltage Rating -
Current Rating (Amps) 0.5A per Contact
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Type Center Strip Contact
Material Flammability Rating UL94 V-0
Product Status Obsolete
Contact Material Copper Alloy
Mfr JAE Electronics
Connector Type Receptacle
Style Board to Cable/Wire
Pitch - Mating 0.020" (0.50mm)
Features Board Guide, Pick and Place, Solder Retention
Contact Finish - Mating Gold
Operating Temperature -40°C ~ 85°C
Number of Rows 1
Applications General Purpose
Number of Positions 50
Termination Solder
Mounting Type Surface Mount
Fastening Type Latch Holder
Insulation Material Thermoplastic
Contact Finish Thickness - Post -
Contact Shape -
Series FI-D
Row Spacing - Mating -
Insulation Color Black
Contact Finish - Post Tin
Number of Positions Loaded All
Contact Length - Post -
Package Bulk
Mated Stacking Heights 4.5mm
Base Product Number FI-TD50