ESQ-122-59-L-T
detaildesc

ESQ-122-59-L-T

Samtec Inc.

Product No:

ESQ-122-59-L-T

Manufacturer:

Samtec Inc.

Package:

-

Batch:

-

Datasheet:

pdf

Description:

CONN SOCKET 66POS 0.1 GOLD PCB

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

In Stock : 100

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $19.779

    $19.779

  • 10

    $17.31565

    $173.1565

  • 100

    $15.498775

    $1549.8775

  • 500

    $14.216142

    $7108.071

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Product Information

Parameter Info

User Guide

Insulation Height 0.635" (16.13mm)
Ingress Protection -
Voltage Rating 550VAC
Current Rating (Amps) 5.7A per Contact
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Type Forked
Material Flammability Rating UL94 V-0
Product Status Active
Contact Material Phosphor Bronze
Mfr Samtec Inc.
Connector Type Elevated Socket
Style Board to Board
Pitch - Mating 0.100" (2.54mm)
Features -
Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Applications -
Number of Positions 66
Termination Solder
Mounting Type Through Hole
Fastening Type Push-Pull
Insulation Material Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post -
Contact Shape Square
Series ESQ
Row Spacing - Mating 0.100" (2.54mm)
Insulation Color Black
Contact Finish - Post Tin
Number of Positions Loaded All
Contact Length - Post 0.280" (7.11mm)
Package Bulk
Mated Stacking Heights -
Base Product Number ESQ-122