DIP600T300P18
detaildesc

DIP600T300P18

Chip Quik Inc.

型号:

DIP600T300P18

封装:

-

批次:

-

数据手册:

pdf

描述:

DIP-18 (0.6" BODY) TO DIP-18 (0.

购买数量:

递送:

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付款:

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产品信息

参数信息

用户指南

Series Proto-Advantage
Package Accepted -
Number of Positions 18
Mfr Chip Quik Inc.
Proto Board Type DIP to DIP
Pitch 0.100" (2.54mm)
Material FR4 Epoxy Glass
Package Bulk
Size / Dimension 0.900" L x 0.700" W (22.86mm x 17.78mm)
Product Status Active
Board Thickness 0.063" (1.60mm)
Base Product Number DIP600